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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7223682 Method of making a semiconductor device using bump material including a liquidExpiredDec 13, 04May 29, 07[H01L]
7199460 Semiconductor device and method of manufacturing the sameExpiredMar 27, 03Apr 03, 07[H01L]
2006/0231,779 Exterior inspection apparatus and exterior inspection methodAbandonedApr 06, 06Oct 19, 06[G01N]
6959485 Bump ball crimping apparatusExpiredOct 10, 03Nov 01, 05[B23K]
6911387 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holesExpiredAug 25, 03Jun 28, 05[H01L, B23P]
6894389 Semiconductor device and manufacturing method thereforExpiredJun 24, 03May 17, 05[H01L]
6881656 Production process for semiconductor apparatusExpiredDec 05, 02Apr 19, 05[H01L]
6774652 Cantilever type probe card and method for production thereofExpiredSep 17, 03Aug 10, 04[G01R]
6753240 Semiconductor device production methodExpiredMay 21, 02Jun 22, 04[H01L]
2004/0031,005 Electronic cad system and layout data producing method thereforAbandonedJan 06, 03Feb 12, 04[G06F]
2003/0183,931 Semiconductor apparatus, fixture for measuring characteristics therefor, and semiconductor device characteristics measuring apparatusAbandonedMar 24, 03Oct 02, 03[H01L]
2003/0159,274 Bump forming system employing attracting and compressing deviceAbandonedFeb 13, 03Aug 28, 03[H01L, B23P]
2003/0087,515 Method for fabricating semiconductor deviceAbandonedOct 29, 02May 08, 03[H01L]
6022400 Polishing abrasive grains, polishing agent and polishing methodExpiredMay 19, 98Feb 08, 00[B24B, C09K]

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