UMC JAPAN
Patent Owner
Stats
- 0 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- May 29, 2007 most recent publication
Details
- 0 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 54 Total Citation Count
- May 19, 1998 Earliest Filing
- 14 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
- No Technology to Display
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Recent Publications
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Recent Patents
- No Recent Patents to Display
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
7223682 Method of making a semiconductor device using bump material including a liquidExpiredDec 13, 04May 29, 07[H01L]
2006/0231,779 Exterior inspection apparatus and exterior inspection methodAbandonedApr 06, 06Oct 19, 06[G01N]
6911387 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holesExpiredAug 25, 03Jun 28, 05[H01L, B23P]
6774652 Cantilever type probe card and method for production thereofExpiredSep 17, 03Aug 10, 04[G01R]
2004/0031,005 Electronic cad system and layout data producing method thereforAbandonedJan 06, 03Feb 12, 04[G06F]
2003/0183,931 Semiconductor apparatus, fixture for measuring characteristics therefor, and semiconductor device characteristics measuring apparatusAbandonedMar 24, 03Oct 02, 03[H01L]
2003/0159,274 Bump forming system employing attracting and compressing deviceAbandonedFeb 13, 03Aug 28, 03[H01L, B23P]
6022400 Polishing abrasive grains, polishing agent and polishing methodExpiredMay 19, 98Feb 08, 00[B24B, C09K]
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