UMICORE GALVANOTECHNIK GMBH
Patent Owner
Stats
- 5 US PATENTS IN FORCE
- 1 US APPLICATIONS PENDING
- Oct 24, 2017 most recent publication
Details
- 5 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 28 Total Citation Count
- Apr 05, 2002 Earliest Filing
- 13 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2016/0348,259 DEPOSITION OF COPPER-TIN AND COPPER-TIN-ZINC ALLOYS FROM AN ELECTROLYTEDec 11, 14Dec 01, 16[C25D]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9797056 Electrolyte for the electrolytic deposition of silver-palladium alloys and method for deposition thereofJul 24, 14Oct 24, 17[C25D]
8273909 Process for preparing complexes of palladium (hydrogen)carbonate with amine ligandsMay 07, 09Sep 25, 12[C07F]
8211286 Electrolyte and method for depositing decorative and technical layers of black rutheniumMar 05, 08Jul 03, 12[C25D]
8136349 Exhaust-gas purification system with particulate filter and method of operation thereof with improved regeneration of the particulate filterMay 12, 04Mar 20, 12[F01N]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2014/0131,209 ELECTROLYTE AND ITS USE FOR THE DEPOSITION OF BLACK RUTHENIUM COATINGS AND COATINGS OBTAINED IN THIS WAYAbandonedJun 08, 12May 15, 14[C25D]
2013/0264,215 DIRECT-CONTACT MEMBRANE ANODE FOR USE IN ELECTROLYSIS CELLSAbandonedDec 08, 11Oct 10, 13[C25D]
2013/0140,185 ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF COPPER-TIN ALLOY LAYERSAbandonedAug 12, 11Jun 06, 13[C25D]
2012/0217,166 PROCESS FOR THE ELECTROLYTIC COPPER PLATING OF ZINC DIECASTING HAVING A REDUCED TENDENCY TO BLISTER FORMATIONAbandonedAug 12, 10Aug 30, 12[C25D]
8211285 Copper-tin electrolyte and method for depositing bronze layersExpiredJan 24, 08Jul 03, 12[C25D]
2011/0308,959 PROCESS FOR THE DEPOSITION OF PLATINUM-RHODIUM LAYERS HAVING IMPROVED WHITENESSAbandonedSep 23, 09Dec 22, 11[C25D]
2011/0236,720 NOBLE METAL-CONTAINING LAYER SEQUENCE FOR DECORATIVE ARTICLESAbandonedNov 03, 09Sep 29, 11[C23C, C25D, B32B]
2011/0174,631 COPPER-TIN ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF BRONZE LAYERSAbandonedJul 06, 09Jul 21, 11[C25D]
2011/0089,043 MODIFIED COPPER-TIN ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF BRONZE LAYERSAbandonedMar 31, 09Apr 21, 11[C25D]
2008/0138,528 Method for Depositing Palladium Layers and Palladium Bath ThereforAbandonedJan 11, 06Jun 12, 08[B05D, C09D]
6878411 Bath for the electrochemical deposition of high-gloss white rhodium coatings and whitening agent for the sameExpiredOct 14, 02Apr 12, 05[C23C, C25D, B05D]
6814850 Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for sameExpiredApr 05, 02Nov 09, 04[C23C, C25D]
2004/0091,385 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatingsAbandonedDec 18, 03May 13, 04[C22C]
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