UNIMICRON TECHNOLOGY CORP.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 14647
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 132234
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 177
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 9124
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 645
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 5200
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 470
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 384
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM3154
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 3101

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0374,748 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFSep 11, 17Dec 28, 17[H01L, H05K]
2017/0229,248 MANUFACTURING METHOD FOR CAPACITORApr 25, 17Aug 10, 17[H01G]
2017/0223,841 CARRIER SUBSTRATEApr 17, 17Aug 03, 17[H01L, H05K]
2017/0171,973 CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOFOct 06, 16Jun 15, 17[H05K]
2016/0363,974 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAMEAug 25, 16Dec 15, 16[H01L, G06F, H05K]
2016/0268,206 INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOFMar 10, 15Sep 15, 16[H01L]
2016/0050,771 MANUFACTURING METHOD OF CIRCUIT STRUCTURE EMBEDDED WITH HEAT-DISSIPATION BLOCKAug 15, 14Feb 18, 16[H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9916990 Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structureDec 01, 15Mar 13, 18[H01L, H05K]
9917046 Manufacturing method of a circuit board having a glass filmJul 04, 16Mar 13, 18[H01L, H01K, H05K]
9913418 Process of an embedded component structureMay 12, 16Mar 06, 18[H05K]
9900997 Manufacturing method of a rigid flex board moduleDec 31, 15Feb 20, 18[H05K]
9887153 Circuit redistribution structure unit and method for manufacturing circuit redistribution structureSep 06, 16Feb 06, 18[H01L, H05K]
9883579 Package structure and manufacturing method thereofNov 16, 16Jan 30, 18[H01L, H05K]
9883598 Circuit board and method for manufacturing the sameOct 10, 16Jan 30, 18[H01L, G06F, H05K]
9859130 Manufacturing method of interposed substrateDec 11, 14Jan 02, 18[C25D, H01L, H05K]
9859159 Interconnection structure and manufacturing method thereofMar 10, 15Jan 02, 18[H01L]
9860980 Circuit board elementSep 22, 16Jan 02, 18[H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0196,095 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOFAbandonedMar 01, 16Jul 06, 17[H05K]
2017/0129,454 SAFETY SYSTEM AND METHOD FOR PREVENTING LIVING BODY FROM BEING LOCKED IN VEHICLEAbandonedNov 10, 15May 11, 17[B60R, B60Q]
2016/0097,130 PREPARATION METHOD OF CONDUCTIVE SPONGE HAVING EFFECT OF SHIELDING ELECTROMAGNETIC WAVEAbandonedOct 02, 14Apr 07, 16[C23C]
2016/0073,505 MANUFACTURING METHOD OF MULTILAYER FLEXIBLE CIRCUIT STRUCTUREAbandonedSep 05, 14Mar 10, 16[H05K]
2016/0012,548 AUTOMATED ACCOUNTING SYSTEM AND METHOD THEREOFAbandonedJul 14, 14Jan 14, 16[G06Q, G07G]
2016/0004,373 METHOD FOR PROVIDING AUXILIARY INFORMATION AND TOUCH CONTROL DISPLAY APPARATUS USING THE SAMEAbandonedNov 17, 14Jan 07, 16[G06F]
2015/0362,198 DEHUMIDIFICATION APPARATUS AND DEHUMIDIFICATION METHODAbandonedJun 15, 14Dec 17, 15[F24F, B01D]
2015/0366,081 MANUFACTURING METHOD FOR CIRCUIT STRUCTURE EMBEDDED WITH ELECTRONIC DEVICEAbandonedJun 15, 14Dec 17, 15[H05K]
2015/0354,852 AIR CONDITIONING APPARATUSAbandonedJun 04, 14Dec 10, 15[F24H, F24F]
2015/0146,285 REFLECTIVE STRUCTURE FOR OPTICAL TOUCH SENSINGAbandonedFeb 04, 14May 28, 15[G02B]
2015/0053,462 WIRING BOARD STRUCTUREAbandonedOct 25, 13Feb 26, 15[H05K]
2014/0335,705 ELECTRICAL CONNECTORAbandonedJul 03, 13Nov 13, 14[H01R]
2014/0263,168 METHOD FOR MANUFACTURING PACKAGE SUBSTRATEAbandonedNov 25, 13Sep 18, 14[H05K]
2014/0264,335 PACKAGE SUBSTRATE AND METHOD FOR TESTING THE SAMEAbandonedMar 18, 13Sep 18, 14[H01L]
2014/0275,440 DIAMINE MONOMER HAVING SIDE CHAIN, POLYIMIDE COMPOUND HAVING SIDE CHAIN AND MANUFACTURING METHOD THEREOFAbandonedMar 18, 13Sep 18, 14[C08G, C07C]
2014/0247,570 CIRCUIT BOARD STRUCTURE HAVING ELECTRONIC COMPONENTS EMBEDDED THEREIN AND METHOD OF FABRICATING THE SAMEAbandonedJun 07, 13Sep 04, 14[H05K]
2014/0239,490 PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOFAbandonedFeb 26, 13Aug 28, 14[H01L]
2014/0174,791 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOFAbandonedDec 26, 12Jun 26, 14[H05K]
2014/0154,463 SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedJan 10, 13Jun 05, 14[B23K, H05K]
2014/0151,099 WIRING BOARD AND LASER DRILLING METHOD THEREOFAbandonedMar 18, 13Jun 05, 14[H05K]

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