UNITED TEST AND ASSEMBLY CENTER LIMITED
Patent Owner
Stats
- 0 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Nov 26, 2013 most recent publication
Details
- 0 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 255 Total Citation Count
- Jun 19, 2002 Earliest Filing
- 14 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
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Recent Publications
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Recent Patents
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Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
8592258 Semiconductor package and method of attaching semiconductor dies to substratesExpiredOct 20, 11Nov 26, 13[H01L]
2010/0109,169 SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAMEAbandonedApr 28, 09May 06, 10[H01L]
2009/0194,871 SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATESAbandonedDec 24, 08Aug 06, 09[H01L]
2009/0008,796 COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECTAbandonedDec 27, 07Jan 08, 09[H01L]
2008/0290,509 Chip Scale Package and Method of Assembling the SameAbandonedDec 02, 04Nov 27, 08[H01L]
2007/0132,081 Multiple stacked die window csp package and method of manufactureAbandonedMar 03, 05Jun 14, 07[H01L]
2004/0195,697 Method of packaging circuit device and packaged deviceAbandonedApr 01, 03Oct 07, 04[H01L]
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