UTAC HONG KONG LIMITED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 10352
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
H04L TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION 1284
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7801309 Private key delivery system and a private key delivery methodAug 24, 05Sep 21, 10[H04L, G06E]
6724071 Molded plastic package with heat sink and enhanced electrical performanceOct 11, 02Apr 20, 04[H01L]
6585905 Leadless plastic chip carrier with partial etch die attach padApr 03, 02Jul 01, 03[H01L, B44C]
6552417 Molded plastic package with heat sink and enhanced electrical performanceJan 09, 01Apr 22, 03[H01L]
6545347 Enhanced leadless chip carrierMar 06, 01Apr 08, 03[H01L]
6498099 Leadless plastic chip carrier with etch back pad singulationApr 08, 99Dec 24, 02[H01L]
6294100 Exposed die leadless plastic chip carrierDec 03, 99Sep 25, 01[C23F]
6242281 Saw-singulated leadless plastic chip carrierJul 28, 99Jun 05, 01[H01L]
6229200 Saw-singulated leadless plastic chip carrierJun 10, 98May 08, 01[H01L]
5596231 High power dissipation plastic encapsulated package for integrated circuit dieNov 30, 94Jan 21, 97[H01L, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2006/0223,229 Ball grid array package and process for manufacturing sameAbandonedMar 17, 06Oct 05, 06[H01L]
2006/0223,237 Method of manufacturing enhanced thermal dissipation integrated circuit packageAbandonedMar 06, 06Oct 05, 06[H01L]
6903304 Process for dressing molded array package saw bladeExpiredSep 12, 03Jun 07, 05[B23K]

Top Inventors for This Owner

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