UTAC - UNITED TEST AND ASSEMBLY TEST CENTER LTD.

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Patent Activity in the Last 10 Years

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Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7851899 Multi-chip ball grid array package and method of manufactureApr 02, 04Dec 14, 10[H01L]
7678610 Semiconductor chip package and method of manufactureOct 28, 05Mar 16, 10[H01L]
7361995 Molded high density electronic packaging structure for high performance applicationsFeb 03, 04Apr 22, 08[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2009/0194,871 SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATESAbandonedDec 24, 08Aug 06, 09[H01L]

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