VIASYSTEMS TECHNOLOGIES CORP., L.L.C.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 814
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 8148
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150
 
  
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 1110

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0316,563 METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD WITH AN ANCHORED CONDUCTIVE CAPApr 23, 15Oct 27, 16[H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9913382 Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive capApr 23, 15Mar 06, 18[H05K]
9736948 Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassembliesOct 28, 13Aug 15, 17[H05K]
9485876 Methods of manufacturing printed circuit boards with stacked micro viasOct 20, 14Nov 01, 16[H01K, H05K]
9017540 Systems and methods for reducing overhang on electroplated surfaces of printed circuit boardsJun 16, 11Apr 28, 15[C23C, C25D, H05K]
9012811 Printed circuit board with embedded heaterMay 29, 12Apr 21, 15[H05B, H05K]
8950063 Methods of manufacturing printed circuit boards with stacked micro viasNov 02, 10Feb 10, 15[H05K]
8863379 Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassembliesAug 09, 11Oct 21, 14[H01K, H05K]
8567053 Methods of manufacturing printed circuit boardsJun 03, 11Oct 29, 13[H01K]
8510941 Methods of manufacturing a printed wiring board having copper wrap plated holeFeb 17, 12Aug 20, 13[H01K]
8453322 Manufacturing methods of multilayer printed circuit board having stacked viaAug 11, 09Jun 04, 13[H01K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0220,675 METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARDAbandonedAug 27, 12Aug 29, 13[H05K]
5335405 Method and apparatus for aligning phototools for photoprocessing of printed circuit boardsExpiredJun 01, 93Aug 09, 94[B23Q]
5206820 Metrology system for analyzing panel misregistration in a panel manufacturing process and providing appropriate information for adjusting panel manufacturing processesExpiredAug 31, 90Apr 27, 93[G01B]
5110036 Method and apparatus for solder leveling of printed circuit boardsExpiredDec 17, 90May 05, 92[B08B]
4978423 Selective solder formation on printed circuit boardsExpiredSep 26, 88Dec 18, 90[H05K]
4793052 Method for positioning a panelExpiredNov 13, 87Dec 27, 88[B23Q]
4467523 Methods of and apparatus for inserting pins into a substrateExpiredNov 30, 81Aug 28, 84[B23P, H05K]

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