VIKING TECH CORPORATION

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01C RESISTORS424
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
B24C ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL117
 
  
 
B28B SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER 127
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9837592 Ceramic substrate and semiconductor package having the sameOct 17, 14Dec 05, 17[H01L, H05K]
9768092 Carrier package and carrier with plural heat conductorsAug 18, 14Sep 19, 17[H01L, H05K]
9728306 Micro-resistance structure with high bending strength, manufacturing method and semi-finished structure thereofAug 05, 15Aug 08, 17[H01C]
9437549 Method for manufacturing ceramic substrateJul 24, 15Sep 06, 16[B24C, H01L, B28B, B23K]
9373430 Resistor componentMay 14, 13Jun 21, 16[H01C]
9204555 Method of electroplating and depositing metalSep 20, 12Dec 01, 15[C25D, H05K]
8841172 Method for forming package substrateAug 24, 12Sep 23, 14[H01L]
8590140 Method for manufacturing alloy resistorSep 01, 10Nov 26, 13[H01C]
8591756 Method of manufacturing a metallized ceramic substrateDec 02, 11Nov 26, 13[C23F]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0170,848 Method of Forming SubstrateAbandonedDec 13, 13Jun 19, 14[H01L]
2014/0027,051 Method of Fabricating a Light Emitting Diode Packaging StructureAbandonedOct 04, 13Jan 30, 14[H01L]
2013/0313,122 Method For Fabricating Conductive Structures of SubstrateAbandonedAug 01, 12Nov 28, 13[C25D]
2013/0098,867 Method for Selective Metallization on a Ceramic SubstrateAbandonedDec 08, 11Apr 25, 13[C23F]
2013/0089,982 Method of Fabricating a Substrate Having Conductive Through HolesAbandonedMar 02, 12Apr 11, 13[H01L]
2013/0082,292 Light Emitting Diode Packaging Structure and Method of Fabricating the SameAbandonedDec 08, 11Apr 04, 13[H01L, B32B]
2012/0211,792 Package Substrate and Method for Forming the SameAbandonedMay 19, 11Aug 23, 12[H01L]
2012/0064,230 METHOD FOR FORMING CONDUCTIVE VIA IN A SUBSTRATEAbandonedSep 13, 10Mar 15, 12[C25D, B05D]
2012/0001,212 Light-Emitting Diode Packaging Structure and Substrate ThereforAbandonedAug 20, 10Jan 05, 12[H01L]
7640652 Method of making a current sensing chip resistorExpiredFeb 08, 07Jan 05, 10[H01C]
2003/0219,919 Package method for enhancing the brightness of LEDAbandonedSep 25, 02Nov 27, 03[H01L]
6365483 Method for forming a thin film resistorExpiredSep 22, 00Apr 02, 02[H01L]
6268225 Fabrication method for integrated passive componentExpiredJul 15, 99Jul 31, 01[H01L, G01R]
6083766 Packaging method of thin film passive components on silicon chipExpiredSep 20, 99Jul 04, 00[H01L]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.