VLSI Packaging Corporation

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5598034 Plastic packaging of microelectronic circuit devicesJul 22, 92Jan 28, 97[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
5362679 Plastic package with solder grid arrayExpiredJul 26, 93Nov 08, 94[H01L]

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