WAFER-LEVEL PACKAGING PORTFOLIO LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 7355
 
  
 
B29D PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE 156

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8017435 Method for packaging electronic devices and integrated circuitsJun 01, 07Sep 13, 11[H01L]
7880179 Process for making contact with and housing integrated circuitsNov 20, 09Feb 01, 11[H01L]
7821106 Process for making contact with and housing integrated circuitsMar 04, 08Oct 26, 10[H01L]
7700397 Process for packaging components, and packaged componentsNov 15, 04Apr 20, 10[H01L]
7700957 Process for making contact with and housing integrated circuitsSep 22, 04Apr 20, 10[H01L]
7160478 Method for producing electronic componetsAug 26, 02Jan 09, 07[B29D]
7071521 Process for producing microelectromechanical components and a housed microelectromechanical componentNov 22, 04Jul 04, 06[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0137,259 Process for Making Contact with and Housing Integrated CircuitsAbandonedJan 08, 13May 30, 13[H01L]
8420445 Method for packing semiconductor components and product produced according to the methodExpiredJun 04, 08Apr 16, 13[H01L]
8399293 Method for packaging electronic devices and integrated circuitsExpiredSep 13, 11Mar 19, 13[H01L]
8349707 Process for making contact with and housing integrated circuitsExpiredSep 30, 10Jan 08, 13[H01L]
8309384 Process for packaging components, and packaged componentsExpiredApr 02, 10Nov 13, 12[H01L]
8114304 Method for producing electronic componentsExpiredNov 22, 06Feb 14, 12[B29D]
2011/0169,171 Dual Interconnection in Stacked Memory and Controller ModuleAbandonedMar 18, 11Jul 14, 11[H01L]
2010/0270,668 Dual Interconnection in Stacked Memory and Controller ModuleAbandonedApr 28, 09Oct 28, 10[H01L]
2009/0324,906 SEMICONDUCTOR WITH TOP-SIDE WRAP-AROUND FLANGE CONTACTAbandonedJun 26, 08Dec 31, 09[B05D, B23K, C23F, B32B]
7285834 Process for producing microelectromechanical components and a housed microelectromechanical componentExpiredMar 18, 06Oct 23, 07[H01L]
6911392 Process for making contact with and housing integrated circuitsExpiredAug 26, 02Jun 28, 05[H01L]
6894358 Process for producing microelectromechanical components and a housed microelectromechanical componentExpiredAug 26, 02May 17, 05[H01L]

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