WIN SEMICONDUCTORS CORP.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 40322
 
  
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 863
 
  
 
H03F AMPLIFIERS 578
 
  
 
H02H EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS 473
 
  
 
G01K MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR 343
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 231
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
  
 
G01C MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY 1104

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0003,570 THERMAL SENSING ACOUSTIC WAVE RESONATOR AND ACOUSTIC WAVE FILTER HAVING THERMAL SENSING ACOUSTIC WAVE RESONATORJun 27, 17Jan 04, 18[G01K, H01L, H03H]
2018/0006,633 INTEGRATED MODULE OF ACOUSTIC WAVE DEVICE WITH ACTIVE THERMAL COMPENSATION AND AN ACTIVE THERMAL COMPENSATING METHOD THEREOFJun 27, 17Jan 04, 18[H03H]
2017/0272,052 Protective Cover for an Acoustic Wave Device and Fabrication Method ThereofJun 08, 17Sep 21, 17[G01K, H03H]
2017/0194,451 Schottky Barrier Semiconductor Device Having a Nanoscale Film InterfaceApr 26, 16Jul 06, 17[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9911837 Heterojunction bipolar transistorJul 07, 16Mar 06, 18[H01L]
9905610 Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereofFeb 28, 17Feb 27, 18[H01L, H03F, H03H]
9812379 Semiconductor package and manufacturing methodOct 19, 16Nov 07, 17[H01L]
9704829 Stacked structure of semiconductor chips having via holes and metal bumpsOct 14, 15Jul 11, 17[H01L]
9692370 Biasing circuitrySep 22, 15Jun 27, 17[H03F]
9673152 High-frequency packageOct 15, 15Jun 06, 17[H01L]
9673186 Semiconductor integrated circuitMar 31, 15Jun 06, 17[H01L]
9660587 Power amplifierOct 14, 15May 23, 17[H03F]
9653408 High-frequency packageOct 14, 15May 16, 17[H01L]
9653516 Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device, and fabrication methods thereofDec 30, 14May 16, 17[H01L, H03H]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0330,843 Advanced Moisture Resistant Structure of Compound Semiconductor Integrated CircuitsAbandonedAug 22, 16Nov 16, 17[H01L]
2017/0222,011 Gate Metal Structure for Compound Semiconductor DevicesAbandonedApr 26, 16Aug 03, 17[H01L]
2016/0020,307 Heterojunction Bipolar TransistorAbandonedApr 21, 15Jan 21, 16[H01L]
2015/0380,531 HETEROJUNCTION BIPOLAR TRANSISTOR WITH IMPROVED CURRENT GAINAbandonedSep 08, 15Dec 31, 15[H01L]
2015/0097,328 WAFER HOLDING STRUCTUREAbandonedOct 08, 13Apr 09, 15[B23Q]
2015/0099,358 METHOD FOR FORMING THROUGH WAFER VIAS IN SEMICONDUCTOR DEVICESAbandonedOct 07, 13Apr 09, 15[H01L]
2014/0283,991 Wafer Edge ProtectorAbandonedMar 20, 13Sep 25, 14[H01L]
2014/0266,280 PROBE CARD, PROBE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEAbandonedMar 14, 14Sep 18, 14[G01R]
2014/0231,876 pHEMT and HBT integrated epitaxial structureAbandonedApr 29, 14Aug 21, 14[H01L]
2014/0209,926 SEMICONDUCTOR INTEGRATED CIRCUITAbandonedJan 28, 13Jul 31, 14[H01L]
2014/0097,515 COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT WITH THREE-DIMENSIONALLY FORMED COMPONENTSAbandonedDec 12, 13Apr 10, 14[H01L]
2013/0341,681 HETEROJUNCTION BIPOLAR TRANSISTOR WITH IMPROVED CURRENT GAIN AND A FABRICATION METHOD THEREOFAbandonedJun 22, 12Dec 26, 13[H01L]
2013/0320,402 pHEMT HBT INTEGRATED EPITAXIAL STRUCTURE AND A FABRICATION METHOD THEREOFAbandonedOct 26, 12Dec 05, 13[H01L]
2013/0277,845 STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICES AND A FABRICATION METHOD THEREOFAbandonedJul 23, 12Oct 24, 13[H01L]
2013/0256,681 GROUP III NITRIDE-BASED HIGH ELECTRON MOBILITY TRANSISTORAbandonedApr 02, 12Oct 03, 13[H01L]
2013/0207,266 Copper Interconnect for III-V Compound Semiconductor DevicesAbandonedJun 26, 12Aug 15, 13[H01L]
2013/0140,671 COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT WITH THREE-DIMENSIONALLY FORMED COMPONENTSAbandonedDec 06, 11Jun 06, 13[H01L]
2013/0099,250 STRUCTURE OF SEMICONDUCTOR CHIPS WITH ENHANCED DIE STRENGTH AND A FABRICATION METHOD THEREOFAbandonedJan 24, 12Apr 25, 13[H01L]
2013/0052,817 METHOD FOR THE FABRICATION OF BONDING SOLDER LAYERS ON METAL BUMPS WITH IMPROVED COPLANARITYAbandonedAug 29, 11Feb 28, 13[H01L]
2012/0115,308 FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER CUTTING TECHNIQUESAbandonedApr 04, 11May 10, 12[H01L]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.