XINTEC INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 244168
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 1915
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 14184
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 1121
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 6441
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
G01L MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE 353
 
  
 
B05B SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 163
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
  
 
B26D CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 136

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0271,432 INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOFJun 02, 17Sep 21, 17[H01L]
2017/0213,802 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOFApr 06, 17Jul 27, 17[H01L]
2017/0213,865 CHIP SCALE SENSING CHIP PACKAGEJan 19, 17Jul 27, 17[H01L]
2017/0186,797 CHIP PACKAGE AND MANUFACTURING METHOD THEREOFDec 28, 16Jun 29, 17[H01L]
2017/0147,857 CHIP PACKAGE AND METHOD FOR FORMING THE SAMENov 21, 16May 25, 17[H01L, G06K]
2017/0148,752 CHIP PACKAGE AND MANUFACTURING METHOD THEREOFNov 14, 16May 25, 17[H01L]
2017/0047,455 SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOFAug 08, 16Feb 16, 17[H01L]
2017/0012,081 CHIP PACKAGE AND MANUFACTURING METHOD THEREOFJun 13, 16Jan 12, 17[H01L]
2016/0380,024 IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOFSep 09, 16Dec 29, 16[H01L]
2016/0315,048 SEMICONDUCTOR ELECTROPLATING SYSTEMApr 25, 16Oct 27, 16[C25D, H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9887229 Sensing chip package and a manufacturing method thereofAug 02, 16Feb 06, 18[H01L]
9881889 Chip package and method for fabricating the sameApr 11, 14Jan 30, 18[H01L]
9881959 Chip package and method of manufacturing the sameAug 05, 15Jan 30, 18[H01L]
9875912 Chip package and manufacturing method thereofNov 21, 16Jan 23, 18[H01L, G06K]
9875924 Spray coater and ring-shaped structure thereofFeb 25, 16Jan 23, 18[B05C, H01L]
9865526 Chip package and method for forming the sameOct 07, 15Jan 09, 18[H01L, B81C, B81B]
9859320 Chip package and manufacturing method thereofDec 28, 16Jan 02, 18[H01L]
9853074 Chip scale sensing chip packageJan 19, 17Dec 26, 17[H01L]
9831185 Chip package and fabrication method thereofApr 26, 16Nov 28, 17[H01L]
9812413 Chip module and method for forming the sameJan 13, 16Nov 07, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2018/0012,853 CHIP PACKAGE AND MANUFACTURING METHOD THEREOFAbandonedJul 06, 17Jan 11, 18[H01L, G06K]
2017/0256,496 CHIP PACKAGE AND METHOD FOR FORMING THE SAMEAbandonedFeb 23, 17Sep 07, 17[H01L]
2017/0207,194 CHIP PACKAGE AND METHOD FOR FORMING THE SAMEAbandonedJan 18, 17Jul 20, 17[H01L]
2017/0186,712 CHIP PACKAGE AND METHOD FOR FORMING THE SAMEAbandonedDec 28, 16Jun 29, 17[H01L]
2017/0117,242 CHIP PACKAGE AND METHOD FOR FORMING THE SAMEAbandonedOct 19, 16Apr 27, 17[H01L]
2017/0110,495 CHIP PACKAGE AND MANUFACTURING METHOD THEREOFAbandonedSep 27, 16Apr 20, 17[H01L]
2017/0110,641 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFAbandonedDec 29, 16Apr 20, 17[H01L]
2017/0098,678 CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOFAbandonedSep 29, 16Apr 06, 17[H01L]
2017/0088,417 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOFAbandonedSep 26, 16Mar 30, 17[H01L, B81C, B81B]
2017/0092,607 CHIP PACKAGE AND METHOD FOR FORMING THE SAMEAbandonedSep 21, 16Mar 30, 17[H01L]
2017/0025,370 CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOFAbandonedJul 13, 16Jan 26, 17[H01L]
2016/0355,393 CHIP PACKAGE AND MANUFACTURING METHOD THEREOFAbandonedJun 02, 16Dec 08, 16[B81C, B81B]
2016/0351,607 IMAGE SENSING DEVICEAbandonedMay 27, 16Dec 01, 16[H01L]
2016/0351,608 CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAMEAbandonedMay 24, 16Dec 01, 16[H01L]
2016/0240,520 CHIP PACKAGE AND MANUFACTURING METHOD THEREOFAbandonedJan 26, 16Aug 18, 16[H01L]
2016/0204,061 CHIP PACKAGE AND FABRICATION METHOD THEREOFAbandonedJan 11, 16Jul 14, 16[H01L]
2015/0325,551 CHIP PACKAGE AND METHOD FOR FORMING THE SAMEAbandonedMay 07, 15Nov 12, 15[H01L]
2015/0303,178 CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAMEAbandonedApr 21, 15Oct 22, 15[H01L]
2015/0255,499 CHIP PACKAGE AND METHOD OF FABRICATING THE SAMEAbandonedFeb 12, 15Sep 10, 15[H01L]
2015/0097,268 INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedSep 11, 14Apr 09, 15[H01L]

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