ZHEN DING TECHNOLOGY CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
B25B TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING143
 
  
 
B41C PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES 116
 
  
 
B41L APPARATUS OR DEVICES FOR MANIFOLDING, DUPLICATING, OR PRINTING FOR OFFICE OR OTHER COMMERCIAL PURPOSES; ADDRESSING MACHINES OR LIKE SERIES-PRINTING MACHINES 118
 
  
 
B41M PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING 148
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1124
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1119
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 177
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0369,653 POLYAMIC ACID, POLYIMIDE, POLYIMIDE FILM AND COPPER CLAD LAMINATE USING THE SAMEApr 26, 17Dec 28, 17[C08J, C08G, H05K]
2017/0362,361 PHOTOSENSITIVE RESIN COMPOSITION, AND FILM AND PRINTED CIRCUIT BOARD USING SAMEApr 11, 17Dec 21, 17[C08F, G03F, H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905508 Package structureAug 31, 17Feb 27, 18[H01L]
9472426 Packaging substrate and method for manufacturing sameSep 01, 15Oct 18, 16[H01L]
9362248 Coreless package structure and method for manufacturing sameJul 15, 14Jun 07, 16[H01L, H05K]
9173298 Packaging substrate, method for manufacturing same, and chip packaging structure having sameDec 05, 13Oct 27, 15[H01L, H05K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0240,464 HYBRID CIRCUIT BOARD AND METHOD FOR MAKING THE SAME, AND SEMICONDUCTOR PACKAGE STRUCTUREAbandonedJul 17, 15Aug 18, 16[H01L]
2016/0066,418 PART-EMBEDDED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING SAMEAbandonedSep 01, 15Mar 03, 16[H05K]
2015/0380,391 PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAMEAbandonedSep 09, 15Dec 31, 15[H01L, H05K]
2015/0189,760 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedDec 25, 14Jul 02, 15[G03F, H05K]
2015/0053,466 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedAug 21, 14Feb 26, 15[H05K]
2015/0000,959 MULTILAYER PRINTED CIRCUIT BOARD HAVING ANISOTROPY CONDICTIVE FILM AND METHOD FOR MANUFACTURING SAMEAbandonedJun 27, 14Jan 01, 15[H05K]
2014/0374,153 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedJan 08, 14Dec 25, 14[H05K]
2014/0353,006 MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedJan 12, 14Dec 04, 14[H05K]
2014/0182,899 RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedDec 18, 13Jul 03, 14[H05K]
2014/0158,407 PRINTED CIRCUIT BOARD WITH VISIBLE TRIANGULAR SHAPED TRACESAbandonedNov 13, 13Jun 12, 14[H05K]
2014/0158,410 POLYIMIDE, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEXIBLE PRINTED CIRCUIT BOARDAbandonedDec 02, 13Jun 12, 14[H05K]
2014/0151,092 PCB WITH VISIBLE CIRCUIT AND METHOD FOR MAKING AND USING PCB WITH VISIBLE CIRCUITAbandonedNov 20, 13Jun 05, 14[H05K]
2014/0146,504 CIRCUIT BOARD, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAMEAbandonedNov 28, 13May 29, 14[H05K]
2014/0144,675 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedNov 19, 13May 29, 14[H05K]
2014/0110,152 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedFeb 26, 13Apr 24, 14[H05K]
2014/0085,833 CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAMEAbandonedSep 17, 13Mar 27, 14[H05K]
2014/0061,951 PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAMEAbandonedFeb 01, 13Mar 06, 14[H01L]
2014/0054,785 CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAMEAbandonedJun 27, 13Feb 27, 14[H01L]
2014/0054,079 MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEAbandonedAug 02, 13Feb 27, 14[H05K]
2014/0036,465 PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAMEAbandonedApr 16, 13Feb 06, 14[H05K]

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