Suan Jeung Boon

Inventor

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Work History

Patent OwnerApplications FiledYear
U.S. BANK NATIONAL ASSOCIATION
2
1
1
1
1
1
2005
2006
2010
2012
2014
2015
MICRON TECHNOLOGY, INC.
1
12
10
4
6
7
11
2
2
6
4
3
2
3
1
1
2000
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2017
SAMSUNG ELECTRONICS CO., LTD.
2
2003

Inventor Addresses

AddressDuration
Jin Kayu, SGSep 25, 07 - Sep 25, 07
Singapore, SGDec 11, 03 - Mar 06, 18

Technology Profile

Technology Matters
G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1
H01K: ELECTRIC INCANDESCENT LAMPS 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 51

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
99116962018Packaged semiconductor assemblies and methods for manufacturing such assemblies0
2017/0207,2062017MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEADS FOR STACKED DIE PACKAGES, AND ASSOCIATED SYSTEMS AND METHODS0
96534442017Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods0
2016/0099,2372016MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEADS FOR STACKED DIE PACKAGES, AND ASSOCIATED SYSTEMS AND METHODS0
91659102015Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods0

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