Suan Jeung Boon

Inventor

1 Status Updates

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Work History

Patent OwnerApplications FiledYear
MICRON TECHNOLOGY, INC.
1
12
10
4
6
7
10
2
2
5
3
3
1
2000
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
SAMSUNG ELECTRONICS CO., LTD.
2
2003

Inventor Addresses

AddressDuration
Jin Kayu, SGSep 25, 07 - Sep 25, 07
Singapore, SGDec 11, 03 - Apr 15, 14

Technology Profile

Technology # of Patents
G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2
H01K: ELECTRIC INCANDESCENT LAMPS 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 68

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
8,698,2952014Super high-density module with integrated wafer level packages0
2014/0015,1302014MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEADS FOR STACKED DIE PACKAGES, AND ASSOCIATED SYSTEMS AND METHODS0
8,564,1062013Wafer level packaging0
8,555,4952013Method for packaging circuits0
8,536,7022013Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods0

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