Suan Jeung Boon
Inventor
Stats
- 41 total patents issued
- 61 total patents filed
- most recent filing
This is official USPTO record data
Details
- 41 Issued Patents
- 61 Filed Patents
- 374 Total Citation Count
- Jan 27, 2012 Most Recent Filing
- Feb 16, 2000 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| MICRON TECHNOLOGY, INC. | 1 7 8 3 6 7 10 2 2 5 1 | 2000 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 |
| SAMSUNG ELECTRONICS CO., LTD. | 1 | 2003 |
Inventor Addresses
| Address | Duration |
|---|---|
| Jin Kayu, SG | Sep 25, 07 - Sep 25, 07 |
| Singapore, SG | Dec 11, 03 - Jan 29, 13 |
Technology Profile
| Technology | # of Patents | |
|---|---|---|
| G01R: | MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 56 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 4 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8,362,594 | 2013 | Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material | 0 |
| 8,362,594 | 2013 | Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material | 0 |
| 8,304,894 | 2012 | Super high-density module with integrated wafer level packages | 1 |
| 8,232,657 | 2012 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | 0 |
| 8,198,720 | 2012 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | 1 |
