Suan Jeung Boon

Inventor

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Work History

Patent OwnerApplications FiledYear
MICRON TECHNOLOGY, INC.
1
12
10
4
6
7
11
2
2
5
3
3
1
1
2000
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
SAMSUNG ELECTRONICS CO., LTD.
2
2003

Inventor Addresses

AddressDuration
Jin Kayu, SGSep 25, 07 - Sep 25, 07
Singapore, SGDec 11, 03 - May 08, 14

Technology Profile

Technology # of Patents
G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2
H01K: ELECTRIC INCANDESCENT LAMPS 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 69

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2014/0124,9602014PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES0
8,698,2952014Super high-density module with integrated wafer level packages0
2014/0015,1302014MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEADS FOR STACKED DIE PACKAGES, AND ASSOCIATED SYSTEMS AND METHODS0
8,564,1062013Wafer level packaging0
8,555,4952013Method for packaging circuits0

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