Larry C Leighton
Inventor
Stats
- 7 total patents issued
- 7 total patents filed
- most recent filing
This is official USPTO record data
Details
- 7 Issued Patents
- 7 Filed Patents
- 61 Total Citation Count
- Jan 10, 2001 Most Recent Filing
- Dec 20, 1996 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 1 1 4 1 | 1996 1997 1998 2001 |
Inventor Addresses
| Address | Duration |
|---|---|
| Santa Cruz, CA | Feb 09, 99 - Mar 02, 99 |
| Scottsdale, AZ | Aug 03, 99 - Oct 15, 02 |
Technology Profile
| Technology | # of Patents | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 4 |
| H03F: | AMPLIFIERS | 1 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 6,466,094 | 2002 | Gain and bandwidth enhancement for RF power amplifier package | 12 |
| 6,181,006 | 2001 | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink | 7 |
| 6,160,710 | 2000 | Capacitive mounting arrangement for securing an integrated circuit package to a heat sink | 8 |
| 5,982,000 | 1999 | Resistive interconnect of transistor cells | 2 |
| 5,933,327 | 1999 | Wire bond attachment of a integrated circuit package to a heat sink | 12 |
