Jun Matsuzawa

Inventor

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Work History

Patent OwnerApplications FiledYear
HITACHI CHEMICAL COMPANY, LTD.
1
1
1
1
1
1
2
1
3
1
3
4
1
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1
1988
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1996
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1999
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2004
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2008
2011
HITACHI, LTD.
1
1
1
1999
2001
2004

Inventor Addresses

AddressDuration
Hitachi, JPApr 23, 91 - Mar 01, 12
Ibaraki-ken, JPFeb 05, 02 - Sep 13, 12
Ibraki-ken, JPJun 08, 06 - Aug 17, 06
Tsukuba, JPJan 14, 92 - May 04, 10
Tsukuba-shi, JPApr 21, 05 - Apr 21, 05

Technology Profile

Technology # of Patents
B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 12
B24D: TOOLS FOR GRINDING, BUFFING, OR SHARPENING 3
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2012/0227,3312012ABRASIVE, METHOD OF POLISHING TARGET MEMBER AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE0
8,162,7252012Abrasive, method of polishing target member and process for producing semiconductor device0
8,137,1592012Abrasive, method of polishing target member and process for producing semiconductor device0
2012/0048,8302012Abrasive Liquid For Metal and Method for Polishing0
2011/0312,2512011Abrasive, Method of Polishing Target Member and Process for Producing Semiconductor Device0

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