Seiichi Mimura

Inventor

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Work History

Patent OwnerApplications FiledYear
AMKOR TECHNOLOGY, INC.
3
2
1991
1992
MITSUBISHI ELECTRIC CORPORATION
2
2
2006
2007
MITSUBISHI DENKI KABUSHIKI KAISHA
1
2
1
2
1997
2001
2002
2004

Inventor Addresses

AddressDuration
Chiyoda-ku, JPDec 13, 11 - Sep 04, 12
Kawagoe, JPApr 28, 92 - Feb 22, 94
Tokyo, JPJul 18, 95 - Jul 01, 10

Technology Profile

Technology # of Patents
B23B: TURNING; BORING 2
B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 1
B24D: TOOLS FOR GRINDING, BUFFING, OR SHARPENING 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
8,256,4072012Multi-wire saw and method for cutting ingot0
8,075,6472011Slurry for slicing silicon ingot and method for slicing silicon ingot using the same1
2010/0163,0092010MULTI-WIRE SAW AND METHOD FOR CUTTING INGOT0
2010/0037,8802010SLURRY FOR SLICING SILICON INGOT AND METHOD FOR SLICING SILICON INGOT USING THE SAME1
7,306,5082007Multi-wire saw6

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