Seiichi Mimura
Inventor
Stats
- 10 total patents issued
- 13 total patents filed
- most recent filing
This is official USPTO record data
Details
- 10 Issued Patents
- 13 Filed Patents
- 146 Total Citation Count
- Jun 27, 2007 Most Recent Filing
- Feb 6, 1991 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| AMKOR TECHNOLOGY, INC. | 3 2 | 1991 1992 |
| MITSUBISHI ELECTRIC CORPORATION | 2 2 | 2006 2007 |
| MITSUBISHI DENKI KABUSHIKI KAISHA | 1 1 1 1 | 1997 2001 2002 2004 |
Inventor Addresses
| Address | Duration |
|---|---|
| Chiyoda-ku, JP | Dec 13, 11 - Sep 04, 12 |
| Kawagoe, JP | Apr 28, 92 - Feb 22, 94 |
| Tokyo, JP | Jul 18, 95 - Jul 01, 10 |
Technology Profile
| Technology | # of Patents | |
|---|---|---|
| B23B: | TURNING; BORING | 1 |
| B24B: | MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING | 1 |
| B24D: | TOOLS FOR GRINDING, BUFFING, OR SHARPENING | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8,256,407 | 2012 | Multi-wire saw and method for cutting ingot | 0 |
| 8,075,647 | 2011 | Slurry for slicing silicon ingot and method for slicing silicon ingot using the same | 1 |
| 2010/0163,009 | 2010 | MULTI-WIRE SAW AND METHOD FOR CUTTING INGOT | 0 |
| 2010/0037,880 | 2010 | SLURRY FOR SLICING SILICON INGOT AND METHOD FOR SLICING SILICON INGOT USING THE SAME | 0 |
| 7,306,508 | 2007 | Multi-wire saw | 5 |
