Isamu Mochizuki

Inventor

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Work History

Patent OwnerApplications FiledYear
HITACHI ULSI ENGINEERING CORPORATION
1
1
1
1995
1996
1997
HITACHI MICROCOMPUTER SYSTEM LTD.
1
1
1
1995
1996
1997
HITACHI ULSI SYSTEMS CO., LTD.
1
2000
RENESAS ELECTRONICS CORPORATION
1
1
1
1
2
1995
1996
1997
2000
2010
TECHNO POLYMER CO., LTD.
1
1
1
2010
2011
2012
JSR CORPORATION
1
1
1
1
1
2000
2002
2003
2005
2007

Inventor Addresses

AddressDuration
Chuo-ku, JPJul 08, 04 - Feb 28, 08
Tachikawa, JPJun 25, 96 - Feb 24, 04
Tokyo, JPJul 23, 02 - Jul 24, 14

Technology Profile

Technology # of Patents
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
C08K: USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 1
C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 2

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2014/0206,8032014THERMOPLASTIC RESIN COMPOSITION FOR REDUCTION OF SQUEAKING NOISES AND STRUCTURE OF REDUCED SQUEAKING NOISES0
2013/0217,8172013CONTACTING PART MADE OF THERMOPLASTIC RESIN COMPOSITION WITH REDUCED SQUEAKING NOISES0
8,238,4402012Semiconductor integrated circuit0
2012/0034,4672012AUTOMOBILE INTERIOR PART WITH REDUCED SQUEAKING NOISES0
2010/0303,1572010SEMICONDUCTOR INTEGRATED CIRCUIT2

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