Masayuki Nishiwaki
Inventor
Stats
- 15 total patents issued
- 20 total patents filed
- most recent filing
This is official USPTO record data
Details
- 15 Issued Patents
- 20 Filed Patents
- 140 Total Citation Count
- May 2, 2006 Most Recent Filing
- Apr 25, 1991 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| CANON KABUSHIKI KAISHA | 2 2 2 1 2 1 9 1 | 1991 1994 1995 1997 1999 2000 2005 2006 |
Inventor Addresses
| Address | Duration |
|---|---|
| Kawaguchi, JP | Nov 24, 98 - Aug 31, 99 |
| Kawasaki, JP | Nov 23, 93 - Oct 27, 98 |
| Soka, JP | Sep 05, 00 - May 29, 01 |
| Yoshikawa, JP | Feb 04, 03 - Feb 07, 12 |
| Yoshikawa-shi, JP | May 25, 06 - Nov 16, 06 |
Technology Profile
| Technology | # of Patents | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 10 |
| B41J: | TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS | 3 |
| G02B: | OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8,108,998 | 2012 | Laser cutting method | 3 |
| 8,093,530 | 2012 | Laser cutting apparatus and laser cutting method | 0 |
| 7,807,940 | 2010 | Laser processing apparatus and laser processing method | 0 |
| 7,791,001 | 2010 | Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus | 0 |
| 7,211,526 | 2007 | Laser based splitting method, object to be split, and semiconductor element chip | 11 |
