Masayuki Ohi
Inventor
Stats
- 1 total patents issued
- 2 total patents filed
- most recent filing
This is official USPTO record data
Details
- 1 Issued Patents
- 2 Filed Patents
- 32 Total Citation Count
- Dec 12, 2001 Most Recent Filing
- Dec 22, 1992 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| AMKOR TECHNOLOGY, INC. | 1 | 1992 |
| APACK TECHNOLOGIES INC. | 1 | 2001 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu, TW | Apr 17, 03 - Apr 17, 03 |
| Tokyo, JP | Jul 18, 95 - Jul 18, 95 |
Technology Profile
| Technology | # of Patents | |
|---|---|---|
| B44C: | PRODUCING DECORATIVE EFFECTS | 1 |
| C03C: | CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS | 1 |
| C23F: | NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2003/0071,354 | 2003 | Wafer level chip scale package and method of fabricating the same | 5 |
| 5,433,822 | 1995 | Method of manufacturing semiconductor device with copper core bumps | 27 |
