Sang Soo Park

Inventor

2 Status Updates

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Details

Work History

Patent OwnerApplications FiledYear
LEE, CHONG SUH
1
2001
NESTEC S.A.
2
2006
SAMSUNG ELECTRO-MECHANICS CO., LTD.
9
14
6
8
35
14
3
5
16
4
2003
2005
2006
2007
2008
2009
2010
2011
2012
2013
Sumitomo Electro-Mechanics Co., Ltd.
1
2008
SOLCO BIOMEDICAL CO., LTD.
3
2
2001
2002
CHOON KI LEE
2
2001
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
1
2001
LEE, CHOON SUNG
2
2002

Inventor Addresses

AddressDuration
Gyeonggi-do, KRDec 28, 06 - Mar 25, 14
Gyunggi-do, KRAug 28, 08 - Jan 28, 14
Kyoungki-do, KRJan 03, 02 - Jan 03, 02
Kyungki-do, KROct 30, 03 - Oct 06, 09
Seoul, KRMar 13, 03 - Sep 21, 04
Suwon, KRApr 01, 04 - Apr 17, 14
Youngtong-ku, KRJul 20, 06 - Jul 20, 06

Technology Profile

Technology # of Patents
A61B: DIAGNOSIS; SURGERY; IDENTIFICATION 3
A61F: FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, E.G. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS 3
B05D: PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2014/0104,7502014MULTI-LAYERED CERAMIC CAPACITOR0
2014/0104,0272014FILTER FOR REMOVING NOISE0
8,681,4752014Mounting structure of circuit board having multi-layered ceramic capacitor thereon0
8,638,5432014Laminated chip electronic component, board for mounting the same, and packing unit thereof0
2014/0022,0422014CHIP DEVICE, MULTI-LAYERED CHIP DEVICE AND METHOD OF PRODUCING THE SAME0

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