Robert Michael Smythe
Inventor
Stats
- 2 total patents issued
- 11 total patents filed
- most recent filing
This is official USPTO record data
Details
- 2 Issued Patents
- 11 Filed Patents
- 1 Total Citation Count
- Jan 30, 2012 Most Recent Filing
- Jun 17, 2009 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| LAIRD TECHNOLOGIES, INC. | 6 2 2 1 | 2009 2010 2011 2012 |
Inventor Addresses
| Address | Duration |
|---|---|
| Cleveland, OH, US | Jul 12, 12 - Jul 12, 12 |
| Ewing, NJ, US | Dec 23, 10 - Aug 09, 12 |
Technology Profile
| Technology | # of Patents | |
|---|---|---|
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| F28F: | DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2012/0201,008 | 2012 | CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES | 0 |
| 2012/0174,956 | 2012 | Thermoelectric Modules, Thermoelectric Assemblies, and Related Methods | 0 |
| 8,193,439 | 2012 | Thermoelectric modules and related methods | 0 |
| 2012/0087,094 | 2012 | Memory Modules Including Compliant Multilayered Thermally-Conductive Interface Assemblies | 0 |
| 2012/0061,135 | 2012 | COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HAVING EMI SHIELDING PROPERTIES | 0 |
