Michael Renne Ty Tan

Inventor

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Work History

Patent OwnerApplications FiledYear
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
1
3
4
2
2007
2008
2010
2013
Avago Technologies General IP (Singapore) Pte. Ltd.
1
2009
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
12
27
18
29
17
25
15
12
8
4
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
2
2005
AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
2
2005
THE UNIVERSITY OF BRISTOL
1
2000
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
1
1
2
1
2
2000
2001
2002
2004
2005
SCHAEFFLER TECHNOLOGIES AG & CO. KG
2
2011

Inventor Addresses

AddressDuration
MENLO PARK, CA, USDec 05, 13 - Dec 05, 13
Menlo Park, CAJul 10, 03 - Dec 21, 06
Menlo Park, CA, USOct 06, 05 - Feb 01, 18
Menlo Park,, CA, USAug 08, 13 - Aug 08, 13
Mento Park, CA, USJan 27, 11 - Feb 09, 12
PALO ALTO, CA, USJul 31, 14 - Jul 31, 14
Palo Alto, CA, USAug 25, 11 - Jan 16, 18

Technology Profile

Technology Matters
B05D: PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 2
B23P: OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 1
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2018/0034,2422018MONOLITHIC WDM VCSEL ARRAYS BY QUANTUM WELL INTERMIXING0
98698362018Optical interconnects0
98717492018Switch assembly0
2017/0351,0412017BONDED FILTER SUBSTRATES0
2017/0315,2992017PHOTONIC INTERPOSER WITH WAFER BONDED MICROLENSES0

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