Cyprian Emeka Uzoh

Inventor

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Details

Work History

Patent OwnerApplications FiledYear
INTERNATIONAL BUSINESS MACHINES CORPORATION
1
1
4
1
6
1
1995
1996
1997
1998
1999
2001
ASM NUTOOL, INC.
1
2
2003
2008
NOVELLUS SYSTEMS, INC.
1
1
5
3
6
2
2
2
1
2
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
GLOBALFOUNDRIES INC.
5
3
2
2
2
2
1
1997
1998
1999
2000
2001
2004
2005
TESSERA, INC.
2
6
5
1
2013
2014
2015
2016
ULTRATECH, INC.
1
1998
INVENSAS CORPORATION
2
24
28
31
29
15
2011
2012
2013
2014
2015
2016
ASM AMERICA, INC.
1
2008
NUTOOL, INC.
1
1999

Inventor Addresses

AddressDuration
Hopewell Junction, CT, USNov 18, 04 - Nov 18, 04
Hopewell Junction, NYMay 26, 98 - Nov 25, 08
Hopewell Junction, NY, USApr 25, 02 - Apr 25, 02
MILPITAS, CA, USApr 25, 02 - Apr 25, 02
Milpitas, CAAug 07, 01 - Dec 18, 07
Milpitas, CA, USJan 31, 02 - Aug 11, 09
SAN JOSE, CA, USMay 28, 15 - May 28, 15
San Jose, CA, USNov 12, 09 - Nov 24, 16

Technology Profile

Technology Matters
A01M: CATCHING, TRAPPING OR SCARING OF ANIMALS 1
A01N: PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF 1
B05D: PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 2

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2016/0343,6132016THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON0
9,502,3902016BVA interposer0
2016/0336,2862016CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE0
9,496,1542016Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias0
2016/0329,3012016METHOD FOR PREPARING LOW COST SUBSTRATES0

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