Cyprian Emeka Uzoh

Inventor

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Details

Work History

Patent OwnerApplications FiledYear
INTERNATIONAL BUSINESS MACHINES CORPORATION
1
1
4
1
6
1
1995
1996
1997
1998
1999
2001
ASM NUTOOL, INC.
1
2
2003
2008
Novellus Systems, Inc.
1
1
5
3
6
2
2
2
1
2
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
GLOBALFOUNDRIES INC.
5
3
2
2
2
2
1
1997
1998
1999
2000
2001
2004
2005
TESSERA, INC.
2
5
3
2013
2014
2015
Ultratech, Inc.
1
1998
INVENSAS CORPORATION
2
24
21
20
14
2011
2012
2013
2014
2015
ASM AMERICA, INC.
1
2008
NUTOOL, INC.
1
1999

Inventor Addresses

AddressDuration
Hopewell Junction, CT, USNov 18, 04 - Nov 18, 04
Hopewell Junction, NYMay 26, 98 - Nov 25, 08
Hopewell Junction, NY, USApr 25, 02 - Apr 25, 02
MILPITAS, CA, USApr 25, 02 - Apr 25, 02
Milpitas, CAAug 07, 01 - Dec 18, 07
Milpitas, CA, USJan 31, 02 - Aug 11, 09
SAN JOSE, CA, USMay 28, 15 - May 28, 15
San Jose, CA, USNov 12, 09 - May 03, 16

Technology Profile

Technology Matters
B05D: PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 2
B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 1
B21D: WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
9,331,0432016Localized sealing of interconnect structures in small gaps0
9,323,0102016Structures formed using monocrystalline silicon and/or other materials for optical and other applications0
2016/0079,0932016USE OF UNDERFILL TAPE IN MICROELECTRONIC COMPONENTS, AND MICROELECTRONIC COMPONENTS WITH CAVITIES COUPLED TO THROUGH-SUBSTRATE VIAS0
2016/0079,1692016POLYMER MEMBER BASED INTERCONNECT0
2016/0079,1892016HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS0

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