Stephan Wenke
Inventor
Stats
- 3 total patents issued
- 4 total patents filed
- most recent filing
This is official USPTO record data
Details
- 3 Issued Patents
- 4 Filed Patents
- 6 Total Citation Count
- Feb 23, 2006 Most Recent Filing
- Nov 2, 1995 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| LPKF LASER & ELECTRONICS AG | 1 1 2 | 1995 2005 2006 |
Inventor Addresses
| Address | Duration |
|---|---|
| Neustadt A. Rbg., DE | Jul 14, 09 - Jul 14, 09 |
| Neustadt a. Rbg., DE | Aug 24, 06 - Aug 24, 06 |
| Neustadt, DE | Aug 26, 08 - Aug 26, 08 |
| Springe, DE | May 20, 97 - May 20, 97 |
Technology Profile
| Technology | # of Patents | |
|---|---|---|
| B23P: | OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS | 1 |
| B27G: | ACCESSORY MACHINES OR APPARATUS; TOOLS | 1 |
| B41C: | PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 7,559,152 | 2009 | Method for determining the position of a milling tool and a machining head designed for carrying out the method | 0 |
| 7,415,927 | 2008 | Procedure for positioning a through-hole in a substrate | 0 |
| 2006/0185,144 | 2006 | Method for determining the position of a milling tool and a machining head designed for carrying out the method | 0 |
| 5,630,272 | 1997 | Method of forming contacts through bores in multi-layer circuit boards | 6 |
