Wai Keong Wong
Inventor
Stats
- 3 total patents issued
- 7 total patents filed
- most recent filing
This is official USPTO record data
Details
- 3 Issued Patents
- 7 Filed Patents
- 2 Total Citation Count
- Jun 15, 2011 Most Recent Filing
- Nov 12, 2008 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| FREESCALE SEMICONDUCTOR, INC. | 2 1 1 3 | 2008 2009 2010 2011 |
Inventor Addresses
| Address | Duration |
|---|---|
| Bukit Rimau, MY | Dec 20, 12 - Dec 20, 12 |
| Shah Alam, MY | May 13, 10 - Jun 12, 12 |
Technology Profile
| Technology | # of Patents | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 2 |
| F27D: | DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2012/0318,853 | 2012 | HEATER BLOCK FOR WIRE BONDING SYSTEM | 0 |
| 8,198,143 | 2012 | Mold and substrate for use with mold | 0 |
| 2012/0104,583 | 2012 | SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME | 0 |
| 2011/0244,637 | 2011 | MOLD AND SUBSTRATE FOR USE WITH MOLD | 0 |
| 8,016,183 | 2011 | Adjustable clamp system and method for wire bonding die assembly | 1 |
