Shintaro Yamamichi

Inventor

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Work History

Patent OwnerApplications FiledYear
NEC CORPORATION
2
1
2
2
1
8
1
1
4
3
11
5
6
12
1
1
1992
1993
1994
1995
1999
2001
2002
2003
2006
2007
2008
2009
2010
2011
2012
2013
RENESAS ELECTRONICS CORPORATION
1
2
1
2
2
4
15
11
10
9
5
6
1
1
1996
1997
2000
2002
2003
2005
2006
2007
2008
2009
2010
2011
2012
2014
NEC ELECTRONICS CORPORATION
1
1
2006
2010

Inventor Addresses

AddressDuration
Kanagawa, JPMay 17, 12 - Jun 10, 14
Kawasaki-shi, JPAug 28, 14 - Aug 28, 14
Minato-ku, JPNov 19, 09 - Aug 19, 14
TOKYO, JPJan 03, 02 - Jan 03, 02
Tokyo, JPNov 16, 93 - Aug 26, 14

Technology Profile

Technology # of Patents
B05D: PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 1
C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1
G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2014/0239,4252014SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE0
8,815,6782014Method for fabricating a metal-insulator-metal (MIM) capacitor having capacitor dielectric layer formed by atomic layer deposition (ALD)0
8,810,0082014Semiconductor element-embedded substrate, and method of manufacturing the substrate0
8,766,4402014Wiring board with built-in semiconductor element0
8,749,0332014Semiconductor device and method of manufacturing semiconductor device0

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