Wafer bonding method for use in making a MEMS gyroscope

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United States of America Patent

PATENT NO 10012670
SERIAL NO

14518688

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A method of making a MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism on a magnetic sensor wafer and a magnetic source on a MEMS wafer that further comprises a proof-mass.

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Patent Owner(s)

Patent OwnerAddress
INSIGH TECH LLCLOS ANGELES CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ju, Tao Beijing, CN 18 28
Zhang, Biao Hinsdale, US 76 155

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