Wafer-level molding chase design

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10020211
SERIAL NO

14302697

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An apparatus includes a mold chase, which includes a top portion and an edge ring having a ring-shape. The edge ring is underlying and connected to an edge of the top portion. The edge ring has an injection port and a venting port. A molding guide kit is configured to be inserted into the injection port. The molding guide kit includes a front sidewall having a curved front edge.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Chih-Fan Kaoshung, TW 64 266
Huang, Hui-Min Taoyuan, TW 110 1043
Hwang, Chien Ling Hsin Chu, TW 115 2469
Jang, Bor-Ping Chu-Bei, TW 44 948
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Yu, Chen-Hua Hsin-Chu, TW 2207 47923

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jan 10, 2026
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 10, 2030
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00