Method for fabricating silicon carbide assemblies

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United States of America Patent

PATENT NO 10032527
SERIAL NO

15176942

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Abstract

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A method for fabricating assemblies includes providing first and second components that include ceramic, metal, or composite; positioning a multiphase joining interlayer between the first and second components, wherein the joining interlayer includes a first phase that melts at a first temperature and a second phase interspersed throughout the first phase, and wherein the second phase melts at a second temperature that is lower than the melting temperature of the first phase; and heating the joining interlayer to a temperature in the range of 725° C. to 1450° C. for a predetermined period of time to soften the first phase and melt the second phase, wherein the first phase remains in a solid or a semi-solid state, and wherein the second phase segregates to the boundaries of the first phase and transforms the joining interlayer into a substantially porosity-free adherent material that joins the first component to the second component.

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Patent Owner(s)

Patent OwnerAddress
EDISON WELDING INSTITUTE INC1250 ARTHUR E ADAMS DRIVE COLUMBUS OH 43221

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ames, Nathan D Sunbury, US 5 34
Cooper, Kirk E Worthington, US 6 28
Herderick, Edward D Powell, US 3 7

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