Substrate processing apparatus and substrate processing method
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United States of America Patent
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Aug 14, 2018
Grant Date -
Feb 15, 2018
app pub date -
Oct 26, 2017
filing date -
Jul 18, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.
First Claim
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- H01J:ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- B05C:APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- G03D:APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATE....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
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