Method for semiconductor die removal rework

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10050012
APP PUB NO 20170148762A1
SERIAL NO

14951935

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Abstract

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Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.

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Patent Owner(s)

  • IBM CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ayotte, Stephen P Bristol, US 35 153
Richard, Glen E Burlington, US 16 87
Sullivan, Timothy M Essex, US 45 326

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