Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device

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United States of America Patent

PATENT NO 10056165
APP PUB NO 20130048162A1
SERIAL NO

13695666

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Abstract

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This copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which is composed of Mg at a content of 3.3 to 6.9 atomic %, and a remainder of Cu and inevitable impurities, and a conductivity σ (% IACS) is within the following range when the content of Mg is given as A atomic %, and/or an average number of intermetallic compounds having grain sizes of 0.1 μm or more is in a range of 1/μm2 or less,

description='In-line Formulae' end='lead'σ≤{1.7241/(−0.0347×A2+0.6569×A+1.7)}×100.description='In-line Formulae' end='tail'

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Patent Owner(s)

  • MITSUBISHI MATERIALS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Yuki Okegawa, JP 236 965
Maki, Kazunari Saitama, JP 69 185

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