Shingle clip system and method
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United States of America Patent
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Oct 2, 2018
Grant Date -
N/A
app pub date -
Nov 21, 2017
filing date -
Nov 21, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure includes roof shingle systems. One roof shingle system includes at least two shingles, a shingle clip, a drip edge, and a power collection unit. Each shingle has a semiconductive layer configured to deliver power, electrical current/voltage, and/or control signals to the power collection unit. The shingle clip continues a conductive path between the two shingles. The drip edge is at least partially insulated and partially conductive, and the conductive portion continues the path from the shingle semiconductive layer to the power unit where energy is collected. One method of installing a shingle system includes the steps of positioning a shingle having a transducer in the form of a semiconductive layer, and positioning a shingle clip to engage the semiconductive layer of the shingle.
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