Multilayer thermal shield comprising an integrated fluid circuit

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United States of America Patent

PATENT NO 10093078
APP PUB NO 20170305116A1
SERIAL NO

15516314

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Importance

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Abstract

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When products to be shipped are temperature-sensitive, it is necessary to maintain a substantially uniform and constant temperature to avoid spoilage. As a result, thermal shields are often placed on top of the products. Many designs for thermal shields have been considered in the past but improvements are still desired. Accordingly, there is provided a multilayer thermal shield (100) comprising a thermally conductive layer (108), and at least one heat exchange fluid circuit (120) coupled to a first surface of the thermally conductive layer, the at least one heat exchange fluid circuit comprising at least one inlet (124) configured to permit the ingress of heat exchange fluid. The thermal shield further comprises an outer insulation layer (104) connected to a first surface of the thermally conductive layer (108) and comprising grooves designed to receive the heat exchange fluid circuit. The thermal shield further comprises an inner insulation layer (110) connected to a second surface of the thermally conductive layer (108).

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SUNWELL ENGINEERING COMPANY LIMITEDWOODBRIDGE ONTARIO L4L 5Y7

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Corey, Rosa Belleville, CA 2 0
Do, Cong-Binh Etobicoke, CA 2 0
Goldstein, Vladimir Woodbridge, CA 25 203

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