Peel ply, method of surface preparation and bonding composite structures using the same
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United States of America Patent
Stats
-
Oct 9, 2018
Grant Date -
Mar 9, 2017
app pub date -
Sep 13, 2016
filing date -
Dec 30, 2011
priority date (Note) -
In Force
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Abstract
A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CYTEC TECHNOLOGY CORP | 300 DELAWARE AVENUE WILMINGTON DE 19801 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kohli, Dalip Kumar | Churchville, US | 21 | 145 |
Shah, Kunal Gaurang | Gujarat, IN | 5 | 48 |
Zhao, Yiqiang | Newark, US | 12 | 37 |
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