Method of manufacturing micro pins and isolated conductive micro pin

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United States of America Patent

PATENT NO 10115690
APP PUB NO 20160254239A1
SERIAL NO

14632654

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Abstract

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A method of manufacturing micro pins includes forming a release layer over a substrate. A pattern layer is formed over the release layer, in which the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer. A plurality of micro pins are respectively formed in the openings. The pattern layer and the release layer are removed to obtain the micro pins. An isolated conductive micro pin for connecting one or more components is also provided.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Ying-Jui Zhubei, TW 50 379
Hwang, Chien-Ling Hsinchu, TW 45 454
Liao, Hsin-Hung Taipei, TW 36 174
Liu, Chung-Shi Hsinchu, TW 824 11367

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