Package substrate and manufacturing method thereof
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United States of America Patent
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Nov 6, 2018
Grant Date -
Aug 31, 2017
app pub date -
May 15, 2017
filing date -
Jun 30, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A temporary package substrate includes a first copper layer, a second copper layer, a third copper layer, a first plating copper layer, a second plating copper layer, a third plating copper layer, a first dielectric layer, a second dielectric layer and two circuit structures. The second copper layer is located between the first and the third copper layers, and edges of the second copper layer are retracted a distance compared to edges of the first copper layer and edges of the third copper layer. The first and the second dielectric layers completely encapsulate the edges of the second copper layer and the edges of the second plating copper layer. Each of the circuit structures includes at least two patterned circuit layers, an insulation layer located between the patterned circuit layers, and a plurality of conductive through hole structures penetrating the insulation layer and electrically connected with the patterned circuit layers.
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