Semiconductor substrate polishing methods and slurries and methods for manufacturing silicon on insulator structures

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United States of America Patent

PATENT NO 10128146
APP PUB NO 20170053826A1
SERIAL NO

15221839

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Abstract

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Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set.

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Patent Owner(s)

Patent OwnerAddress
GLOBALWAFERS CO LTDHSINCHU TAIWAN R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Capstick, James Raymond Florissant, US 3 1
Ragan, Tracy Michelle Warrenton, US 5 2
Tanna, Vandan O'Fallon, US 13 12
Wang, Hui Wildwood, US 1115 8921

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