Package on-package process for applying molding compound

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10134703
APP PUB NO 20150008581A1
SERIAL NO

14494069

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Importance

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Abstract

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A method of packaging includes placing a package component over a release film, wherein solder regions on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder regions remain in physical contact with the release film.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Kuei-Wei Hsin-Chu, TW 72 1278
Jang, Bor-Ping Chu-Bei, TW 44 948
Lin, Chih-Wei Zhubei, TW 359 5145
Lin, Chun-Cheng New Taipei, TW 100 1465
Lin, Hsiu-Jen Zhubei, TW 172 1408
Lin, Wei-Hung Xinfeng Township, TW 175 1616
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Lu, Wen-Hsiung Jhonghe, TW 127 2473
Tsai, Yu-Peng Taipei, TW 43 1203
Wu, Sheng-Yu Hsin-Chu, TW 57 433

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