Substrate processing apparatus, substrate processing method and recording medium
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 27, 2018
Grant Date -
Oct 4, 2018
app pub date -
Mar 30, 2018
filing date -
Mar 31, 2017
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A coating and developing apparatus 2 includes a first protection processing unit U01, a film forming unit U02, a first cleaning processing unit U03 and a control unit U08. The control unit U08 is configured to control the first protection processing unit U01 to form a first protective film on a peripheral portion Wc of a wafer W, control the film forming unit U02 to form a resist film on a front surface Wa of the wafer W, control the first cleaning processing unit U03 to supply a first cleaning liquid for removing the resist film to the peripheral portion Wc, control the first cleaning processing unit U03 to supply a second cleaning liquid for removing a metal component to the peripheral portion Wc, and control the first cleaning processing unit U03 to supply a third cleaning liquid for removing the first protective film PF1 to the peripheral portion Wc.
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