Surface-mountable over-current protection device
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United States of America Patent
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Nov 27, 2018
Grant Date -
Nov 22, 2018
app pub date -
Nov 30, 2017
filing date -
May 16, 2017
priority date (Note) -
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Abstract
A surface-mountable over-current protection device comprises at least one chip, a first lead and a second lead. The chip comprises a PTC material layer and two metal electrode layers disposed on upper and lower surfaces of the PTC material layer. The first lead is bent into multiple portions comprising a first electrode connecting portion connecting to one of the two metal electrode layers of the at least one chip and a first soldering portion for surface-mounting. The second lead is bent into multiple portions comprising a second electrode connecting portion connecting to another one of the two electrode layers of the at least one chip and a second soldering portion for surface-mounting. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein, and the conductive filler has a resistivity less than 500μΩ·cm. The surface-mountable over-current protection device can withstand a cycle life test of 300 cycles at 20V/40A without blowout.
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