Semiconductor bonding structures and methods

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United States of America Patent

PATENT NO 10153180
APP PUB NO 20150091193A1
SERIAL NO

14044504

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Abstract

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A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Kuei-Wei Hsinchu, TW 72 1278
Lin, Hsiu-Jen Zhubei, TW 172 1408
Lin, Wei-Hung Xinfeng Township, TW 175 1616
Liu, Chung-Shi Hsin-Chu, TW 824 11367

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