Substrate processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10170345
APP PUB NO 20180012780A1
SERIAL NO

15638611

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed is a substrate processing apparatus that includes: a polishing table; an atomizer configured to spray a fluid to a polishing surface; a polishing liquid supply nozzle configured to drop a slurry at a position that corresponds to a slurry dropping position set on the polishing table and is lower than the top surface of the atomizer; a nozzle moving mechanism configured to move the polishing liquid supply nozzle above the atomizer between the retreat position set outside the polishing table and the slurry dropping position; and a nozzle tip retreating mechanism configured to bring the tip end of the polishing liquid supply nozzle into a retreated position above the top surface of the atomizer when the polishing liquid supply nozzle moves between the slurry dropping position and the retreat position.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510 ?1448510

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Yutaka Tokyo, JP 311 3245
Shinozaki, Hiroyuki Tokyo, JP 122 2620

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