Adhesive composition and semiconductor device using same

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United States of America Patent

PATENT NO 10174226
APP PUB NO 20150137347A1
SERIAL NO

14407579

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Abstract

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An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass % or greater and the zinc atom content is from 0.01 mass % to 0.6 mass %, with respect to the total transition metal atoms in the solid portion of the adhesive composition.

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Patent Owner(s)

  • HITACHI CHEMICAL COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishikawa, Dai Tsukuba, JP 65 8375
Matsumoto, Hiroshi Tsukuba, JP 501 5669
Nakako, Hideo Tsukuba, JP 28 95
Natori, Michiko Tsukuba, JP 10 44
Tanaka, Toshiaki Tsukuba, JP 347 6481

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