Polishing composition

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United States of America Patent

PATENT NO 10190024
APP PUB NO 20170247574A1
SERIAL NO

15519578

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Abstract

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Provided is a polishing composition capable of keeping a good polishing removal rate stably. The polishing composition includes silica particles as abrasives and a basic compound as a polishing removal accelerator. The silica particles have a density of silanol groups that is 1.5 to 6.0 pieces/nm2. The polishing composition has an adsorption ratio parameter A that is 1.2 or less, the adsorption ratio parameter representing concentration dependency of an amount of adsorption of the basic compound to the silica particles as the ratio of high-concentration adsorption amount/low-concentration adsorption amount.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATEDNISHIKASUGAI-GUN AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahashi, Shuhei Aichi, JP 70 379
Tomatsu, Masatoshi Aichi, JP 4 14

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