Apparatus and method for dispensing developer onto semiconductor substrate

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United States of America Patent

PATENT NO 10203606
SERIAL NO

15873944

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Abstract

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A dispensing head for dispensing a developer onto a substrate is provided. The dispensing head includes a housing configured to receive the developer. The dispensing head further includes at least one liquid outlet provided on the housing. The liquid outlet is configured to spray the developer onto an elongated area on the substrate. Also, the liquid outlet is configured to spray the developer along a dispensing direction that is tilted with respect to the normal direction of the substrate and perpendicular to the long-axis direction of the elongated area.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Chia-Cheng Hsinchu, TW 20 6
Chen, Chun-Kuang Guanxi Township, Hsinchu County, TW 130 732
Wang, Chung-Cheng Hsinchu, TW 34 238

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