Conveyance apparatus
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United States of America Patent
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-
Mar 12, 2019
Grant Date -
Jun 7, 2018
app pub date -
Dec 1, 2017
filing date -
Dec 5, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A soldering apparatus as a conveyance apparatus includes a substrate loading portion to load a substrate on the soldering apparatus, an intermittent feeding unit to intermittently feed the substrate loaded on the soldering apparatus, a substrate discharge portion to discharge the intermittently fed substrate to the outside of the soldering apparatus and a controller to control conveyance of the substrate. The substrate loading portion includes a first conveyance path to convey the substrate, a first sensor provided in the vicinity of a substrate loading inlet of the substrate loading portion, and a second sensor arranged in a downstream side of the first sensor along the substrate conveyance direction. The intermittent feeding unit includes a second conveyance path for conveying the substrate, and a third sensor placed in the vicinity of an upstream end of the intermittent feeding unit along the substrate conveyance direction.
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