Component temperature control using a combination of proportional control valves and pulsed valves
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United States of America Patent
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Apr 9, 2019
Grant Date -
May 2, 2013
app pub date -
Oct 15, 2012
filing date -
Oct 27, 2011
priority date (Note) -
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Abstract
Methods and systems for controlling temperatures in plasma processing chamber with a combination of proportional and pulsed fluid control valves. A heat transfer fluid loop is thermally coupled to a chamber component, such as a chuck. The heat transfer fluid loop includes a supply line and a return line to each of hot and cold fluid reservoirs. In an embodiment, an analog valve (e.g., in the supply line) is controlled between any of a closed state, a partially open state, and a fully open state based on a temperature control loop while a digital valve (e.g., in the return line) is controlled to either a closed state and a fully open state.
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